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A platform for research: civil engineering, architecture and urbanism
Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions
Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions
Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions
Fu, W. E. (author) / Chen, C. C. (author) / Huang, K. W. (author) / Chang, Y. Q. (author)
WEAR -LAUSANNE- ; 278/279 ; 87-93
2012-01-01
7 pages
Article (Journal)
English
DDC:
620.11292
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