Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Electroplating Condition on Deposition Rate and Performance of Electroplated Au - Fe Coating on Copper Wares
Effect of Electroplating Condition on Deposition Rate and Performance of Electroplated Au - Fe Coating on Copper Wares
Effect of Electroplating Condition on Deposition Rate and Performance of Electroplated Au - Fe Coating on Copper Wares
Yang, F.-g. (Autor:in) / Lu, Z.-y. (Autor:in) / Ruan, S.-j. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 44 ; 43-44
01.01.2011
2 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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