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Effect of Electroplating Condition on Deposition Rate and Performance of Electroplated Au - Fe Coating on Copper Wares
Effect of Electroplating Condition on Deposition Rate and Performance of Electroplated Au - Fe Coating on Copper Wares
Effect of Electroplating Condition on Deposition Rate and Performance of Electroplated Au - Fe Coating on Copper Wares
Yang, F.-g. (author) / Lu, Z.-y. (author) / Ruan, S.-j. (author)
MATERIALS PROTECTION -WUHAN- ; 44 ; 43-44
2011-01-01
2 pages
Article (Journal)
Unknown
DDC:
620.1
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