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Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
Tsao, L. C. (Autor:in) / Huang, C. H. (Autor:in) / Chung, C. H. (Autor:in) / Chen, R. S. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 545 ; 194-200
01.01.2012
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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