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Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
Tsao, L. C. (author) / Huang, C. H. (author) / Chung, C. H. (author) / Chen, R. S. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 545 ; 194-200
2012-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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