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Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array
Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array
Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array
MATERIALS LETTERS ; 78 ; 72-74
01.01.2012
3 pages
Aufsatz (Zeitschrift)
Englisch
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