Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Mathematical Model Correlating Thickness of Brush Electroplated Coating on Ink Scraper with Brush Electroplating Parameters
Mathematical Model Correlating Thickness of Brush Electroplated Coating on Ink Scraper with Brush Electroplating Parameters
Mathematical Model Correlating Thickness of Brush Electroplated Coating on Ink Scraper with Brush Electroplating Parameters
Shi, L.-p. (Autor:in) / Zhang, J.-c. (Autor:in) / Wu, Y.-g. (Autor:in) / Qin, H.-b. (Autor:in) / Zhang, H.-d. (Autor:in)
MATERIALS PROTECTION -WUHAN- ; 45 ; 11-13
01.01.2012
3 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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