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Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging
Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging
Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging
01.01.2012
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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