Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Zhou, Y. / Wang, H. / Wang, L. et al. | British Library Online Contents | 2012

Future packaging: Market forecasts for microelectronic packaging

British Library Online Contents | 2009

Aluminum Nitride for Microelectronic Packaging

British Library Online Contents | 1994

Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging

Felba, J. / Falat, T. / Wymyslowski, A. | British Library Online Contents | 2007

Modified PTFE composite dielectric material with high thermal conductivity and low dielectric constant and preparation method thereof

SHEN JIE / TANG YANGHENG / ZHOU JING et al. | Europäisches Patentamt | 2021