Study on nanocomposite Ti-Al-Si-Cu-N films with various Si contents deposited by cathodic vacuum arc ion plating: Fid-Bau Portal

Study on nanocomposite Ti-Al-Si-Cu-N films with various Si contents deposited by cathodic vacuum arc ion plating

Shi, J. / Muders, C. M. / Kumar, A. / Jiang, X. / Pei, Z. L. / Gong, J. / Sun, C.

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Study on nanocomposite Ti-Al-Si-Cu-N films with various Si contents deposited by cathodic vacuum arc ion plating

Shi, J. / Muders, C. M. / Kumar, A. / Jiang, X. / Pei, Z. L. / Gong, J. / Sun, C.

Study on nanocomposite Ti-Al-Si-Cu-N films with various Si contents deposited by cathodic vacuum arc ion plating

Shi, J. / Muders, C. M. / Kumar, A. / Jiang, X. / Pei, Z. L. / Gong, J. / Sun, C.

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Titel:

Study on nanocomposite Ti-Al-Si-Cu-N films with various Si contents deposited by cathodic vacuum arc ion plating

Beteiligte:

Shi, J. (Autor:in) / Muders, C. M. (Autor:in) / Kumar, A. (Autor:in) / Jiang, X. (Autor:in) / Pei, Z. L. (Autor:in) / Gong, J. (Autor:in) / Sun, C. (Autor:in)

Erschienen in:

APPLIED SURFACE SCIENCE ; 258 ; 9642-9649

Erscheinungsdatum:

01.01.2012

Format / Umfang:

8 pages

ISSN:

0169-4332

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 621.35

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