Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The effect of stacking fault energy on equilibrium grain size and tensile properties of nanostructured copper and copper–aluminum alloys processed by equal channel angular pressing
The effect of stacking fault energy on equilibrium grain size and tensile properties of nanostructured copper and copper–aluminum alloys processed by equal channel angular pressing
The effect of stacking fault energy on equilibrium grain size and tensile properties of nanostructured copper and copper–aluminum alloys processed by equal channel angular pressing
Huang, C. X. (Autor:in) / Hu, W. (Autor:in) / Yang, G. (Autor:in) / Zhang, Z. F. (Autor:in) / Wu, S. D. (Autor:in) / Wang, Q. Y. (Autor:in) / Gottstein, G. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 556 ; 638-647
01.01.2012
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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