Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding: Fid-Bau Portal

Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding

Kavosi, J. / Saei, M. / Kazeminezhad, M.

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Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding

Kavosi, J. / Saei, M. / Kazeminezhad, M.

Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding

Kavosi, J. / Saei, M. / Kazeminezhad, M.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding

Beteiligte:

Kavosi, J. (Autor:in) / Saei, M. (Autor:in) / Kazeminezhad, M. (Autor:in)

Erschienen in:

COMPUTATIONAL MATERIALS SCIENCE ; 67 ; 359-363

Erscheinungsdatum:

01.01.2013

Format / Umfang:

5 pages

ISSN:

0927-0256

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.1 / 510

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