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    Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding

    New search for: Kavosi, J.
    New search for: Saei, M.
    New search for: Kazeminezhad, M.

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    Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding

    New search for: Kavosi, J.
    New search for: Saei, M.
    New search for: Kazeminezhad, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding

    New search for: Kavosi, J.
    New search for: Saei, M.
    New search for: Kazeminezhad, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Dislocation density and flow stress modeling of nanostructured Al-SiCp composite during accumulative roll bonding

    Contributors:

    Kavosi, J. (author) / Saei, M. (author) / Kazeminezhad, M. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 67 ; 359-363

    Publication date:

    2013-01-01

    Size:

    5 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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