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Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
Kuo, D. H. (Autor:in) / Lin, C. Y. (Autor:in) / Jhou, Y. C. (Autor:in) / Cheng, J. Y. (Autor:in) / Liou, G. S. (Autor:in)
POLYMER COMPOSITES ; 34 ; 252-258
01.01.2013
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.192
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