Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method: Fid-Bau Portal

Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method

Kuo, D. H. / Lin, C. Y. / Jhou, Y. C. / Cheng, J. Y. / Liou, G. S.

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Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method

Kuo, D. H. / Lin, C. Y. / Jhou, Y. C. / Cheng, J. Y. / Liou, G. S.

Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method

Kuo, D. H. / Lin, C. Y. / Jhou, Y. C. / Cheng, J. Y. / Liou, G. S.

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Check availability in my library

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Document information

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Document information

Title:

Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method

Contributors:

Kuo, D. H. (author) / Lin, C. Y. (author) / Jhou, Y. C. (author) / Cheng, J. Y. (author) / Liou, G. S. (author)

Published in:

POLYMER COMPOSITES ; 34 ; 252-258

Publication date:

2013-01-01

Size:

7 pages

ISSN:

0272-8397

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.192

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