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Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler
Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler
Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler
Tsao, L. C. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 565 ; 63-71
01.01.2013
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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