Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructures in front of crack tips for various propagation rates and re-evolution of the dislocation under changing propagation crack rates in pure polycrystalline copper with a large grain size
Microstructures in front of crack tips for various propagation rates and re-evolution of the dislocation under changing propagation crack rates in pure polycrystalline copper with a large grain size
Microstructures in front of crack tips for various propagation rates and re-evolution of the dislocation under changing propagation crack rates in pure polycrystalline copper with a large grain size
Huang, H. L. (Autor:in) / Mao, S. W. (Autor:in) / Hu, T. L. (Autor:in) / Ho, N. J. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 570 ; 114-122
01.01.2013
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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| British Library Online Contents | 2000
The model of crack propagation in polycrystalline copper at various propagating rates
| British Library Online Contents | 2000
Dislocation structures around crack tips of fatigued polycrystalline copper
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