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Microstructures in front of crack tips for various propagation rates and re-evolution of the dislocation under changing propagation crack rates in pure polycrystalline copper with a large grain size
Microstructures in front of crack tips for various propagation rates and re-evolution of the dislocation under changing propagation crack rates in pure polycrystalline copper with a large grain size
Microstructures in front of crack tips for various propagation rates and re-evolution of the dislocation under changing propagation crack rates in pure polycrystalline copper with a large grain size
Huang, H. L. (author) / Mao, S. W. (author) / Hu, T. L. (author) / Ho, N. J. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 570 ; 114-122
2013-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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