Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
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Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate
Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate
Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate
Narayan, S. (Autor:in) / Prabhu, K.N. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 29 ; 464-473
01.01.2013
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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