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Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel
Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel
Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel
Zou, J.T. (Autor:in) / Liu, Y.F. (Autor:in) / Pei, L. (Autor:in) / Wang, X.H. (Autor:in) / Liang, S.H. (Autor:in) / Han, Y. / Liu, X. / Lv, G.
01.01.2013
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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