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Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel
Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel
Study on the Interface Diffusion Bonding of the Copper Alloy/30CrMnSi Steel
Zou, J.T. (author) / Liu, Y.F. (author) / Pei, L. (author) / Wang, X.H. (author) / Liang, S.H. (author) / Han, Y. / Liu, X. / Lv, G.
2013-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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