Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The use of potassium peroxidisulphate and Oxone® as oxidizers for the chemical mechanical polishing of silicon wafers
The use of potassium peroxidisulphate and Oxone® as oxidizers for the chemical mechanical polishing of silicon wafers
The use of potassium peroxidisulphate and Oxone® as oxidizers for the chemical mechanical polishing of silicon wafers
Piñeiro, A. (Autor:in) / Black, A. (Autor:in) / Medina, J. (Autor:in) / Dieguez, E. (Autor:in) / Parra, V. (Autor:in)
WEAR -LAUSANNE- ; 303 ; 446-450
01.01.2013
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11292
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A micro-contact and wear model for chemical-mechanical polishing of silicon wafers
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