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The use of potassium peroxidisulphate and Oxone® as oxidizers for the chemical mechanical polishing of silicon wafers
The use of potassium peroxidisulphate and Oxone® as oxidizers for the chemical mechanical polishing of silicon wafers
The use of potassium peroxidisulphate and Oxone® as oxidizers for the chemical mechanical polishing of silicon wafers
Piñeiro, A. (author) / Black, A. (author) / Medina, J. (author) / Dieguez, E. (author) / Parra, V. (author)
WEAR -LAUSANNE- ; 303 ; 446-450
2013-01-01
5 pages
Article (Journal)
English
DDC:
620.11292
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A micro-contact and wear model for chemical-mechanical polishing of silicon wafers
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