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Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping
Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping
Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping
Zhu, X. (Autor:in) / Chung, C. (Autor:in) / Korach, C. S. (Autor:in) / Kao, I. (Autor:in)
WEAR -LAUSANNE- ; 305 ; 14-22
01.01.2013
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11292
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