Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad

Wang, J. B. / Li, Z. / Zhu, Y. W. et al. | British Library Online Contents | 2018

Process Optimization of Lapping Sapphire Substrate with Fixed Diamond Abrasive Pad

Wang, J. B. / Li, Z. / Gao, H. et al. | British Library Online Contents | 2016

Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping

Lv, X. / Yuan, J.L. / Wen, D.H. | British Library Online Contents | 2009

Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates

Kim, H. M. / Manivannan, R. / Moon, D. J. et al. | British Library Online Contents | 2013

Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping

Zhu, X. / Chung, C. / Korach, C. S. et al. | British Library Online Contents | 2013