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Grain Size Variation during Low Temperature Creep and Tensile Deformation of Ultrafine-Grained Copper
Grain Size Variation during Low Temperature Creep and Tensile Deformation of Ultrafine-Grained Copper
Grain Size Variation during Low Temperature Creep and Tensile Deformation of Ultrafine-Grained Copper
Okubo, S. (Autor:in) / Miyajima, Y. (Autor:in) / Fujii, T. (Autor:in) / Onaka, S. (Autor:in) / Kato, M. (Autor:in)
01.01.2013
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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