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On the Stability of Defects and Grain Size in Ultrafine-Grained Copper during Cyclic Deformation and Subsequent Ageing at Room Temperature
On the Stability of Defects and Grain Size in Ultrafine-Grained Copper during Cyclic Deformation and Subsequent Ageing at Room Temperature
On the Stability of Defects and Grain Size in Ultrafine-Grained Copper during Cyclic Deformation and Subsequent Ageing at Room Temperature
Huang, C. X. (Autor:in) / Wang, S. C. (Autor:in) / Wu, S. D. (Autor:in) / Jiang, C. B. (Autor:in) / Li, G. Y. (Autor:in) / Li, S. X. (Autor:in)
MATERIALS SCIENCE FORUM ; 475/479 ; 4055-4058
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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