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Creep behavior under isothermal and non-isothermal conditions of AM3 single crystal superalloy for different solutioning cooling rates
Creep behavior under isothermal and non-isothermal conditions of AM3 single crystal superalloy for different solutioning cooling rates
Creep behavior under isothermal and non-isothermal conditions of AM3 single crystal superalloy for different solutioning cooling rates
Steuer, S. (Autor:in) / Hervier, Z. (Autor:in) / Thabart, S. (Autor:in) / Castaing, C. (Autor:in) / Pollock, T. M. (Autor:in) / Cormier, J. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 601 ; 145-152
01.01.2014
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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