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Creep behavior under isothermal and non-isothermal conditions of AM3 single crystal superalloy for different solutioning cooling rates
Creep behavior under isothermal and non-isothermal conditions of AM3 single crystal superalloy for different solutioning cooling rates
Creep behavior under isothermal and non-isothermal conditions of AM3 single crystal superalloy for different solutioning cooling rates
Steuer, S. (author) / Hervier, Z. (author) / Thabart, S. (author) / Castaing, C. (author) / Pollock, T. M. (author) / Cormier, J. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 601 ; 145-152
2014-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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