Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics
Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics
Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics
Medgyes, B. (Autor:in) / Horvath, B. (Autor:in) / Illes, B. (Autor:in) / Shinohara, T. (Autor:in) / Tahara, A. (Autor:in) / Harsanyi, G. (Autor:in) / Krammer, O. (Autor:in)
CORROSION SCIENCE ; 92 ; 43-47
01.01.2015
5 pages
Aufsatz (Zeitschrift)
Englisch
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2015
|Effective diffusivity of lead free solder alloys
British Library Online Contents | 2009
|Solder Bumping - Mastering Challenges of Lead-free Alloys
British Library Online Contents | 2005
|Electrochemical migration of tin in electronics and microstructure of the dendrites
British Library Online Contents | 2011
|Nickel-alloyed tin-lead eutectic solder for surface mount technology
British Library Online Contents | 1993
|