Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development: Fid-Bau Portal

Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development

Li, L. / Gong, M. / Chui, Y. H. / Liu, Y.

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Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development

Li, L. / Gong, M. / Chui, Y. H. / Liu, Y.

Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development

Li, L. / Gong, M. / Chui, Y. H. / Liu, Y.

Zugriff

Zugriff über TIB

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Bestellung bei Subito €

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Titel:

Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development

Beteiligte:

Li, L. (Autor:in) / Gong, M. (Autor:in) / Chui, Y. H. (Autor:in) / Liu, Y. (Autor:in)

Erschienen in:

WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 50 ; 23-37

Erscheinungsdatum:

01.01.2016

Format / Umfang:

15 pages

ISSN:

0043-7719

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.12

Li, L. / Gong, M. / Chui, Y. H. et al. | British Library Online Contents | 2016

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Belt, T. / Rautkari, L. / Laine, K. et al. | British Library Online Contents | 2013

Micromorphological studies of surface densified wood

Laine, K. / Segerholm, K. / Wålinder, M. et al. | British Library Online Contents | 2014

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WANG HANGLING / HU YUXIN | Europäisches Patentamt | 2020

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Stability of densified soil under adverse moisture conditions

Gupta, S.N. | Engineering Index Backfile | 1949

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