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Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development
Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development
Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development
Li, L. (author) / Gong, M. (author) / Chui, Y. H. (author) / Liu, Y. (author)
WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 50 ; 23-37
2016-01-01
15 pages
Article (Journal)
English
DDC:
620.12
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