Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Palladium-free electroless deposition of pure copper film on glass substrate using hydrazine as reducing agent
Palladium-free electroless deposition of pure copper film on glass substrate using hydrazine as reducing agent
Palladium-free electroless deposition of pure copper film on glass substrate using hydrazine as reducing agent
Nobari, N. (Autor:in) / Behboudnia, M. (Autor:in) / Maleki, R. (Autor:in)
APPLIED SURFACE SCIENCE ; 385 ; 9-17
01.01.2016
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2016
|British Library Online Contents | 2012
|Electroless plating of copper on surface-modified glass substrate
British Library Online Contents | 2011
|Palladium - Free Activation Process for Electroless Nickel Plating on Silicon Substrate
British Library Online Contents | 2011
|British Library Online Contents | 2013
|