Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model
Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model
Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model
Huang, M. L. (Autor:in) / Yang, Y. C. (Autor:in) / Chen, Y. (Autor:in) / Dong, C. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 664 ; 221-226
01.01.2016
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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