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Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model
Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model
Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model
Huang, M. L. (author) / Yang, Y. C. (author) / Chen, Y. (author) / Dong, C. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 664 ; 221-226
2016-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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