Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Basic modelling of tertiary creep of copper
Basic modelling of tertiary creep of copper
Basic modelling of tertiary creep of copper
Sui, F. (Autor:in) / Sandström, R. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 53 ; 6850-6863
01.01.2018
14 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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