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Basic modelling of tertiary creep of copper
Basic modelling of tertiary creep of copper
Basic modelling of tertiary creep of copper
Sui, F. (author) / Sandström, R. (author)
JOURNAL OF MATERIALS SCIENCE ; 53 ; 6850-6863
2018-01-01
14 pages
Article (Journal)
English
DDC:
620.11
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