Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Materials challenges in three-dimensional integrated circuits
Materials challenges in three-dimensional integrated circuits
Materials challenges in three-dimensional integrated circuits
Chen, Kuan-Neng (Autor:in) / Tu, King-Ning (Autor:in)
MRS bulletin ; 40 ; 219-219
01.01.2015
1 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620
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