Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste near Room Temperature
Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste near Room Temperature
Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste near Room Temperature
Peng, Peng (Autor:in) / He, Peng (Autor:in) / Zou, Guisheng (Autor:in) / Liu, Lei (Autor:in) / Zhou, Y. Norman (Autor:in)
Materials transactions ; 56 ; 1010-1014
01.01.2015
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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