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The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique
The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique
The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique
Rahmani, Nassim (Autor:in) / Willard, Bethany (Autor:in) / Lease, Kevin (Autor:in) / Legesse, Ephriem T. (Autor:in) / Soltani, Seyed A. (Autor:in) / Keshavanarayana, Suresh (Autor:in)
Polymer testing ; 46 ; 14-20
01.01.2015
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1920287
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