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The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique
The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique
The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique
Rahmani, Nassim (author) / Willard, Bethany (author) / Lease, Kevin (author) / Legesse, Ephriem T. (author) / Soltani, Seyed A. (author) / Keshavanarayana, Suresh (author)
Polymer testing ; 46 ; 14-20
2015-01-01
7 pages
Article (Journal)
English
DDC:
620.1920287
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