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Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems
Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems
Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems
Benedetti, Andrea (Autor:in) / Fernandes, Pedro (Autor:in) / Granja, José L. (Autor:in) / Sena-Cruz, José (Autor:in) / Azenha, Miguel (Autor:in)
Composites.Part B, Engineering ; 89 ; 219-229
01.01.2016
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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