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    Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems

    New search for: Benedetti, Andrea
    New search for: Fernandes, Pedro
    New search for: Granja, José L.
    New search for: Sena-Cruz, José
    New search for: Azenha, Miguel

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    Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems

    New search for: Benedetti, Andrea
    New search for: Fernandes, Pedro
    New search for: Granja, José L.
    New search for: Sena-Cruz, José
    New search for: Azenha, Miguel

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems

    New search for: Benedetti, Andrea
    New search for: Fernandes, Pedro
    New search for: Granja, José L.
    New search for: Sena-Cruz, José
    New search for: Azenha, Miguel

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems

    Contributors:

    Benedetti, Andrea (author) / Fernandes, Pedro (author) / Granja, José L. (author) / Sena-Cruz, José (author) / Azenha, Miguel (author)

    Published in:

    Composites.Part B, Engineering ; 89 ; 219-229

    Publication date:

    2016-01-01

    Size:

    11 pages

    ISSN:

    1359-8368

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.118

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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