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Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux
Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux
Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux
Itou, Shouetsu (Autor:in)
Journal of thermal stresses ; 37 ; 749-770
01.01.2014
22 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1121
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