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    Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux

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    Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux

    New search for: Itou, Shouetsu

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    Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux

    New search for: Itou, Shouetsu

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Thermal Stresses Around Two Parallel Interface Cracks Between a Nonhomogeneous Bonding Layer and Two Dissimilar Elastic Half-Planes Under Uniform Heat Flux

    Contributors:

    Itou, Shouetsu (author)

    Published in:

    Journal of thermal stresses ; 37 ; 749-770

    Publication date:

    2014-01-01

    Size:

    22 pages

    ISSN:

    0149-5739

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1121

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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