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Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
Yang, Xu-Sheng (Autor:in) / Wang, Yun-Jiang (Autor:in) / Zhai, Hui-Ru (Autor:in) / Wang, Guo-Yong (Autor:in) / Su, Yan-Jing (Autor:in) / Dai, L.H. (Autor:in) / Ogata, Shigenobu (Autor:in) / Zhang, Tong-Yi (Autor:in)
Journal of the mechanics and physics of solids ; 94 ; 191-206
01.01.2016
16 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
531.05
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