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Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
Yang, Xu-Sheng (author) / Wang, Yun-Jiang (author) / Zhai, Hui-Ru (author) / Wang, Guo-Yong (author) / Su, Yan-Jing (author) / Dai, L.H. (author) / Ogata, Shigenobu (author) / Zhang, Tong-Yi (author)
Journal of the mechanics and physics of solids ; 94 ; 191-206
2016-01-01
16 pages
Article (Journal)
English
DDC:
531.05
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