Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Study on nano-pores enlargement during Ag-assisted electroless etching of diamond wire sawn polycrystalline silicon wafers
Study on nano-pores enlargement during Ag-assisted electroless etching of diamond wire sawn polycrystalline silicon wafers
Study on nano-pores enlargement during Ag-assisted electroless etching of diamond wire sawn polycrystalline silicon wafers
Niu, Yu-Chao (Autor:in) / Liu, Hsing-Tsun (Autor:in) / Liu, Xiang-Ju (Autor:in) / Jiang, Yan-Sen (Autor:in) / Ren, Xian-Kun (Autor:in) / Cai, Pei (Autor:in) / Zhai, Tong-Guang (Autor:in)
Materials science in semiconductor processing ; 56 ; 119-126
01.01.2016
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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Fracture strength of silicon wafers sawn by fixed diamond wire saw
| British Library Online Contents | 2017
Fracture strength of silicon wafers sawn by fixed diamond wire saw
| British Library Online Contents | 2017
Prediction of the thickness for silicon wafers sawn by diamond wire saw
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Prediction of the thickness for silicon wafers sawn by diamond wire saw
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| British Library Online Contents | 2016