A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Study on nano-pores enlargement during Ag-assisted electroless etching of diamond wire sawn polycrystalline silicon wafers
Study on nano-pores enlargement during Ag-assisted electroless etching of diamond wire sawn polycrystalline silicon wafers
Study on nano-pores enlargement during Ag-assisted electroless etching of diamond wire sawn polycrystalline silicon wafers
Niu, Yu-Chao (author) / Liu, Hsing-Tsun (author) / Liu, Xiang-Ju (author) / Jiang, Yan-Sen (author) / Ren, Xian-Kun (author) / Cai, Pei (author) / Zhai, Tong-Guang (author)
Materials science in semiconductor processing ; 56 ; 119-126
2016-01-01
8 pages
Article (Journal)
English
DDC:
621.38152
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