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Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Yuan, Xinjian ( Autor:in ) / Tang, Kunlun ( Autor:in ) / Deng, Yongqiang ( Autor:in ) / Luo, Jun ( Autor:in ) / Sheng, Guangmin ( Autor:in )
Materials & design ; 52 ; 359-366
01.01.2013
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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